สรุป: Discover the Infrared Picosecond Dual-platform Glass Laser Cutting Equipment, designed for high-precision cutting of quartz and sapphire. This advanced system uses ultra-short picosecond laser pulses for clean, crack-free cuts with minimal thermal damage, ideal for semiconductor and optical applications.
คุณสมบัติของผลิตภัณฑ์ที่เกี่ยวข้อง:
High-precision cutting with ultra-short picosecond laser pulses for minimal thermal damage.
Dual-platform design for flexible and efficient processing of hard and brittle materials.
Capable of cutting quartz, sapphire, optical glass, and other brittle materials with precision.
Customizable platform sizes (700*1200mm or 900*1400mm) to suit various production needs.
High-speed processing of special-shaped workpieces improves efficiency.
Clean cuts with no taper, small edge collapse, and no hand injuries.
Low operating costs, high yield rate, and no consumables or pollution.