เครื่องตัดลวดเพชรสำหรับ SiC แซฟไฟร์ ควอตซ์ และแก้ว

วิดีโออื่นๆ
August 19, 2025
การเชื่อมต่อหมวดหมู่: อุปกรณ์ห้องปฏิบัติการวิทยาศาสตร์
สรุป: Discover the Diamond Wire Cutting Machine for SiC Sapphire Quartz Glass, an advanced solution for slicing ultra-hard materials with high precision. Ideal for semiconductors, photovoltaics, and gemstone finishing, this machine offers high-speed, low-damage cutting with minimal kerf loss.
คุณสมบัติของผลิตภัณฑ์ที่เกี่ยวข้อง:
  • High-speed diamond wire cutting up to 1500 m/min for efficient material processing.
  • Precision feed control with servo-driven system ensures micron-level accuracy.
  • Continuous coolant and cleaning system reduces thermal effects and debris.
  • Automatic wire tension adjustment maintains consistent cut thickness.
  • Versatile cutting options including straight, curved, and multi-slice synchronous cuts.
  • Expandable functions like rotary worktables for angled and circular slicing.
  • Durable mechanical design with heavy-duty casting for long-term accuracy.
  • Touchscreen interface with smart parameter storage for easy operation.
คำถามที่พบบ่อย:
  • What materials can the Diamond Wire Cutting Machine process?
    The machine is optimized for SiC, sapphire, quartz, silicon, ceramics, glass, and gemstones.
  • How accurate is the cutting process?
    For a 6-inch SiC wafer, cutting accuracy can reach less than 3 μm, ensuring excellent flatness and surface quality.
  • What makes diamond wire cutting better than traditional methods?
    Compared to abrasive wire or laser cutting, it offers higher speed, reduced kerf loss, lower thermal stress, and superior edge quality.
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วิดีโออื่นๆ
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