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| ชื่อแบรนด์: | ZMSH |
| ปริมาณการสั่งซื้อขั้นต่ำ: | 1 |
| ราคา: | by case |
| รายละเอียดการบรรจุ: | กล่องแบบกำหนดเอง |
| เงื่อนไขการจ่ายเงิน: | ที/ที |
Ti/Cu metal-coated silicon wafers are fabricated by depositing a titanium (Ti) adhesion layer followed by a copper (Cu) conductive layer on high-quality substrates using standard magnetron sputtering. The Ti layer enhances film adhesion and interfacial stability, while the Cu layer provides excellent electrical conductivity. Multiple wafer sizes, conductivity types, orientations, resistivity ranges, and film thicknesses are available, with full customization supported for research and industrial prototyping.
Film stack: Substrate + Adhesion layer (Ti) + Coating layer (Cu)
Deposition process: Standard magnetron sputtering (optional: thermal evaporation / electroplating by request)
Key features: Strong adhesion, low resistance surface, suitable for subsequent lithography, electroplating build-up, or device fabrication.
| Item | Specification / Options |
|---|---|
| Wafer size | 2", 4", 6", 8"; 10×10 mm pieces; any custom size available |
| Conductivity type | P-type, N-type, Intrinsic high-resistivity (Un) |
| Crystal orientation | <100>, <111>, etc. |
| Resistivity | Low: < 0.0015 Ω·cm; Medium: 1–10 Ω·cm; High: > 1000–10000 Ω·cm |
| Substrate thickness (µm) | 2": 200 / 280 / 400 / 500 / as required; 4": 450 / 500 / 525 / as required; 6": 625 / 650 / 675 / as required; 8": 650 / 700 / 725 / 775 / as required |
| Substrate material | Silicon (Si); optional: quartz, BF33 glass, etc. |
| Stack structure | Substrate + Ti adhesion layer + Cu coating |
| Deposition method | Magnetron sputtering (standard); optional: thermal evaporation / electroplating |
| Available metal films (series) | Ti/Cu; also available: Au, Pt, Al, Ni, Ag, etc. |
| Film thickness | 10 nm, 50 nm, 100 nm, 150 nm, 300 nm, 500 nm, 1 µm, etc. (customizable) |
Ohmic contacts & electrodes: conductive substrates, contact pads, electrical testing
Seed layer for electroplating: RDL, microstructures, MEMS electroplating processes
Nanomaterials & thin-film research: sol–gel substrates, nanomaterial growth and characterization
Microscopy & probe metrology: SEM, AFM, and other scanning probe microscopy applications
Bio/chemical platforms: cell culture, protein/DNA microarrays, reflectometry substrates, sensing platforms
Excellent adhesion enabled by Ti interlayer
High conductivity and uniform Cu surface
Wide selection of wafer sizes, resistivity ranges, and orientations
Flexible customization for size, substrate, film stack, and thickness
Stable, repeatable process using mature sputtering technology
Q1: Why is a Ti layer used under the Cu coating?
A: Titanium works as an adhesion (bonding) layer, improving the attachment of copper to the substrate and enhancing interface stability, which helps reduce peeling or delamination during handling and processing.
Q2: What is the typical Ti/Cu thickness configuration?
A: Common combinations include Ti: tens of nm (e.g., 10–50 nm) and Cu: 50–300 nm for sputtered films. Thicker Cu layers (µm-level) are often achieved by electroplating on a sputtered Cu seed layer, depending on your application.
Q3: Can you coat both sides of the wafer?
A: Yes. Single-side or double-side coating is available upon request. Please specify your requirement when ordering.
